As part of continued growth within the North American region, our client is seeking a Technical Program Manager North America, based in the Portland OR area, to establish growth and manage a team and facility to support customers within the region.

Job Responsibilities:

• Responsible for respective personnel in Portland, OR area region as well as for a dedicated Team of Product Specialist throughout North America.
• Responsible for the swift, precise and compliant execution of customer requests with the local team given available resources and within budget considerations.
• Recognize systems and process deficiencies and recommend innovative solutions as needed.
• Participate in customer discussions and lead technical meetings ensuring coordination of customer communications and follow up to actions items.
• Meet regularly with customers to ensure alignment on key projects, product installations, acceptances, demonstrations, evaluations, and roadmaps.
• Manage, train and coach the local team to support Advanced Packaging equipment platforms.
• Apply knowledge and support business development of Advanced Packaging trends and anticipate impact of customer’s wafer fab processes changes and requirements.
• Provide guidance to internal project teams for technology development and product roadmap generation, including the participation in new package/silicon/product brainstorming in support of IP generation.
• Hire and develop an exceptional staff as needed.
• Establish and keep a close relationship with HQ
• Reporting to the SVP of sub-micron die attach BU in Austria.

Required Qualifications:

• Knowledge of semiconductor industry, specifically BEOL equipment and processes including Advanced Packaging technologies.
• Excellent leadership and communication skills and ability to build trustworthy customer networks and relationships.
• B.S. in Physics, Electrical Engineering, Materials Science or related required. Master’s degree preferred.
• At least 8+ years of direct relevant experience required.
• Minimum of 3 years team management experience.
• Based in Portland OR area or willing to relocate.

Other Desired Experience and Qualifications:

• Good understanding of die attach, packaging and plating equipment and technologies.
• Existing influential relationships with key semiconductor customer factory personnel within the Portland, OR region.
• 5 years in the product customer service support and in handling customers and/or branch offices.
• Understanding of precision mechanics and complex systems
• Understanding of factory automation and SW feature needs
• Six-sigma education.
• IT knowledge (Office, E-Mail, CRM).
• Good verbal and written skills
• No contractual limitations have contingent worker access to key US semiconductor customers.