Key Responsibilities:

• Develop and improve RF components/systems for plasma processing equipment (including characterization and qualification).
• Lead and participate in cross-functional teams within the BU (mechanical, electrical, systems, process, supply chain,…), and with suppliers, to continuously improve the tool’s process capability, performance, and productivity.
• Data analysis to rapidly provide solutions to customer problems and determine appropriate limits and specifications for tool operation.
• Lead projects and functional teams from C&F phase through to full release and high-volume manufacturing
• Work with product groups to develop and execute a roadmap for RF technology.
• Other engineering duties, as necessary.

Requirements:

• Ph.D.  or MS with 5+ years relevant experience, or BS with 10+ years relevant experience.
• Detailed knowledge on state-of-the-art plasma etch/strip processing, hardware design, and hands on troubleshooting skills of plasma processing equipment.
• Able to deal with complicated internal or customer problems under deadline pressure, in a highly dynamic environment.
• Self-motivated and able to take initiative.
• Strong verbal and written communication skills.
• In-depth knowledge of the interaction between equipment design and process performance.
• Able and willing to travel internationally to support critical customer issues.